LDBCC2560GC5N0 |
KEMET ELECTRONICS CORP |
|
0.056uF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1812 (4532 Metric)
|
0.185" L x 0.130" W (4.70mm x 3.30mm)
|
0.067" (1.70mm)
|
Solder Pads
|
-
|
FCP1210C563G |
CORNELL-DUBILIER ELECTRONICS INC |
|
0.056uF
|
-
|
16V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1210 (3225 Metric)
|
0.126" L x 0.098" W (3.20mm x 2.50mm)
|
0.067" (1.70mm)
|
Solder Pads
|
-
|
FCP1210C563G-G2 |
CORNELL-DUBILIER ELECTRONICS INC |
|
0.056uF
|
-
|
16V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1210 (3225 Metric)
|
0.126" L x 0.098" W (3.20mm x 2.50mm)
|
0.067" (1.70mm)
|
Solder Pads
|
-
|
FCP1913H563G |
CORNELL-DUBILIER ELECTRONICS INC |
|
0.056uF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1913 (4833 Metric)
|
0.189" L x 0.130" W (4.80mm x 3.30mm)
|
0.067" (1.70mm)
|
Solder Pads
|
-
|
FCP1913H563G-E2 |
CORNELL-DUBILIER ELECTRONICS INC |
|
0.056uF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1913 (4833 Metric)
|
0.189" L x 0.130" W (4.80mm x 3.30mm)
|
0.091" (2.30mm)
|
Solder Pads
|
-
|
ECH-U1H563GX9 |
PANASONIC ELECTRIC WORKS CORP OF AMERICA |
|
0.056uF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1913 (4833 Metric)
|
0.189" L x 0.130" W (4.80mm x 3.30mm)
|
0.067" (1.70mm)
|
Solder Pads
|
-
|
ECH-U1H563GC9 |
PANASONIC ELECTRIC WORKS CORP OF AMERICA |
|
0.056uF
|
-
|
50V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1913 (4833 Metric)
|
0.189" L x 0.130" W (4.80mm x 3.30mm)
|
0.087" (2.20mm)
|
Solder Pads
|
-
|
ECH-U1C563GX5 |
PANASONIC ELECTRIC WORKS CORP OF AMERICA |
|
0.056uF
|
-
|
16V
|
Polyphenylene Sulfide (PPS)
|
±2%
|
-
|
-55°C ~ 125°C
|
Surface Mount
|
1210 (3225 Metric)
|
0.126" L x 0.098" W (3.20mm x 2.50mm)
|
0.067" (1.70mm)
|
Solder Pads
|
-
|