| Part Numbers | Manufacturer Name | Datasheet | Capacitance | Voltage Rating - AC | Voltage Rating - DC | Dielectric Material | Tolerance | ESR (Equivalent Series Resistance) | Operating Temperature | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) | Termination | Lead Spacing |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LDBCC2560GC5N0 | KEMET ELECTRONICS CORP | 0.056uF | - | 50V | Polyphenylene Sulfide (PPS) | ±2% | - | -55°C ~ 125°C | Surface Mount | 1812 (4532 Metric) | 0.185" L x 0.130" W (4.70mm x 3.30mm) | 0.067" (1.70mm) | Solder Pads | - | |
| QYX1H563KTP | NICHICON CORP | 0.056uF | - | 50V | Polyester | ±10% | - | -40°C ~ 85°C | Through Hole | Radial | 0.295" L x 0.177" W (7.50mm x 4.50mm) | 0.433" (11.00mm) | PC Pins | 0.197" (5.00mm) | |
| DSF050J563 | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyester, Metallized - Stacked | ±5% | - | -40°C ~ 85°C | Through Hole | Radial | 0.287" L x 0.126" W (7.30mm x 3.20mm) | 0.236" (6.00mm) | PC Pins | 0.197" (5.00mm) | |
| FCP1913H563J | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyphenylene Sulfide (PPS) | ±5% | - | -55°C ~ 125°C | Surface Mount | 1913 (4833 Metric) | 0.189" L x 0.130" W (4.80mm x 3.30mm) | 0.067" (1.70mm) | Solder Pads | - | |
| FCP1913H563G | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyphenylene Sulfide (PPS) | ±2% | - | -55°C ~ 125°C | Surface Mount | 1913 (4833 Metric) | 0.189" L x 0.130" W (4.80mm x 3.30mm) | 0.067" (1.70mm) | Solder Pads | - | |
| FCN1913H563J | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyester, Polyethylene Naphthalate (PEN), Metalli | ±5% | - | -55°C ~ 105°C | Surface Mount | 1913 (4833 Metric) | 0.189" L x 0.130" W (4.80mm x 3.30mm) | 0.063" (1.60mm) | Solder Pads | - | |
| FCN1913H563J-E2 | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyester, Polyethylene Naphthalate (PEN), Metalli | ±5% | - | -55°C ~ 105°C | Surface Mount | 1913 (4833 Metric) | 0.189" L x 0.130" W (4.80mm x 3.30mm) | 0.063" (1.60mm) | Solder Pads | - | |
| FCP1913H563G-E2 | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyphenylene Sulfide (PPS) | ±2% | - | -55°C ~ 125°C | Surface Mount | 1913 (4833 Metric) | 0.189" L x 0.130" W (4.80mm x 3.30mm) | 0.091" (2.30mm) | Solder Pads | - | |
| FCP1913H563J-E2 | CORNELL-DUBILIER ELECTRONICS INC | 0.056uF | - | 50V | Polyphenylene Sulfide (PPS) | ±5% | - | -55°C ~ 125°C | Surface Mount | 1913 (4833 Metric) | 0.189" L x 0.130" W (4.80mm x 3.30mm) | 0.091" (2.30mm) | Solder Pads | - | |
| QYX1H563JTP | NICHICON CORP | 0.056uF | - | 50V | Polyester | ±5% | - | -40°C ~ 85°C | Through Hole | Radial | 0.295" L x 0.177" W (7.50mm x 4.50mm) | 0.433" (11.00mm) | PC Pins | 0.197" (5.00mm) |
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