Manufacture :NXP SEMICONDUCTORS
5.5°C/W Jh,Thermal Resistance
5 parts found
Part Numbers Manufacturer Name Datasheet Diode Type Reverse DC Voltage(Vr) Current - Average Rectified (Io) Forward Voltage (Vf) Speed Reverse Recovery Time (trr) Reverse Leakage Current @ Vr Capacitance @ Vr, F Thermal Resistance Operating Temperature - Junction Mounting Type Package / Case
BYV25FX-600,127 NXP SEMICONDUCTORS
Standard 600V 5A 1.9V @ 5A Fast Recovery =< 500ns, > 200mA (Io) 35ns 50µA @ 600V - 5.5°C/W Jh 150°C (Max) Through Hole TO-220-2 Full Pack, Isolated Tab
BYV29X-600,127 NXP SEMICONDUCTORS
Standard 600V 9A 1.26V @ 8A Fast Recovery =< 500ns, > 200mA (Io) 60ns 50µA @ 600V - 5.5°C/W Jh 150°C (Max) Through Hole TO-220-2 Full Pack, Isolated Tab
BYV29FX-600,127 NXP SEMICONDUCTORS
Standard 600V 9A 1.9V @ 8A Fast Recovery =< 500ns, > 200mA (Io) 35ns 50µA @ 600V - 5.5°C/W Jh 150°C (Max) Through Hole TO-220-2 Full Pack, Isolated Tab
BYV25X-600,127 NXP SEMICONDUCTORS
Standard 600V 5A 1.3V @ 5A Fast Recovery =< 500ns, > 200mA (Io) 60ns 50µA @ 600V - 5.5°C/W Jh 150°C (Max) Through Hole TO-220-2 Full Pack, Isolated Tab
BYV29G-600,127 NXP SEMICONDUCTORS
Standard 600V 9A 1.25V @ 8A Fast Recovery =< 500ns, > 200mA (Io) 60ns 50µA @ 600V - 5.5°C/W Jh 150°C (Max) Through Hole TO-262-3 Long Leads, I²Pak, TO-262AA