Manufacture :NXP SEMICONDUCTORS
3-UDFN Exposed Pad,Package / Case
5 parts found
Part Numbers Manufacturer Name Datasheet Diode Type Reverse DC Voltage(Vr) Current - Average Rectified (Io) Forward Voltage (Vf) Speed Reverse Recovery Time (trr) Reverse Leakage Current @ Vr Capacitance @ Vr, F Thermal Resistance Operating Temperature - Junction Mounting Type Package / Case
PMEG6020EPA,115 NXP SEMICONDUCTORS
Schottky 60V 2A 575mV @ 2A Fast Recovery =< 500ns, > 200mA (Io) 78ns 250µA @ 60V 250pF @ 1V, 1MHz 10°C/W Jl 150°C (Max) Surface Mount 3-UDFN Exposed Pad
PMEG3020EPA,115 NXP SEMICONDUCTORS
Schottky 30V 2A 470mV @ 2A Fast Recovery =< 500ns, > 200mA (Io) 47ns 2.5mA @ 30V 150pF @ 1V, 1MHz 12°C/W Jl 150°C (Max) Surface Mount 3-UDFN Exposed Pad
PMEG4020EPA,115 NXP SEMICONDUCTORS
Schottky 40V 2A 535mV @ 2A Fast Recovery =< 500ns, > 200mA (Io) 85ns 100µA @ 40V 270pF @ 1V, 1MHz 10°C/W Jl 150°C (Max) Surface Mount 3-UDFN Exposed Pad
PMEG2020EPA,115 NXP SEMICONDUCTORS
Schottky 20V 2A 420mV @ 2A Fast Recovery =< 500ns, > 200mA (Io) 50ns 1.9mA @ 20V 175pF @ 1V, 1MHz 12°C/W Jl 150°C (Max) Surface Mount 3-UDFN Exposed Pad
PMEG2010EPA,115 NXP SEMICONDUCTORS
Schottky 20V 1A 375mV @ 1A Fast Recovery =< 500ns, > 200mA (Io) 50ns 1.9mA @ 20V 175pF @ 1V, 1MHz 12°C/W Jl 150°C (Max) Surface Mount 3-UDFN Exposed Pad