MURS105T3G |
ON SEMICONDUCTOR |
|
Standard
|
50V
|
2A
|
875mV @ 1A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
35ns
|
2µA @ 50V
|
-
|
13°C/W Jl
|
-65°C ~ 175°C
|
Surface Mount
|
DO-214AA, SMB
|
CD214B-R350 |
BOURNS INC |
|
Standard
|
50V
|
3A
|
1V @ 1A
|
Standard Recovery >500ns, > 200mA (Io)
|
-
|
5µA @ 50V
|
40pF @ 4V, 1MHz
|
13°C/W Jl
|
-65°C ~ 175°C
|
Surface Mount
|
DO-214AA, SMB
|
CEFB101-G |
COMCHIP TECHNOLOGY CORP |
|
Standard
|
50V
|
1A
|
875mV @ 1A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
25ns
|
5µA @ 50V
|
-
|
13°C/W Jl
|
150°C (Max)
|
Surface Mount
|
DO-214AA, SMB
|
1N5802US |
MICROSEMI COMMERCIAL BUSINESS UNIT |
|
Standard
|
50V
|
1A
|
875mV @ 1A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
25ns
|
1µA @ 50V
|
25pF @ 10V, 1MHz
|
13°C/W Jl
|
-65°C ~ 175°C
|
-
|
-
|
1N6073US |
MICROSEMI COMMERCIAL BUSINESS UNIT |
|
Standard
|
50V
|
3A
|
2.04V @ 9.4A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
30ns
|
1µA @ 50V
|
-
|
13°C/W Jl
|
-65°C ~ 155°C
|
-
|
-
|
1N6073 |
MICROSEMI COMMERCIAL BUSINESS UNIT |
|
Standard
|
50V
|
850mA
|
2.04V @ 9.4A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
30ns
|
1µA @ 50V
|
-
|
13°C/W Jl
|
-65°C ~ 155°C
|
Through Hole
|
A, Axial
|
1N6076 |
MICROSEMI COMMERCIAL BUSINESS UNIT |
|
Standard
|
50V
|
1.3A
|
1.76V @ 18.8A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
30ns
|
5µA @ 50V
|
-
|
13°C/W Jl
|
-65°C ~ 155°C
|
Through Hole
|
A, Axial
|
1N6079 |
MICROSEMI COMMERCIAL BUSINESS UNIT |
|
Standard
|
50V
|
2A
|
1.5V @ 37.7A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
30ns
|
10µA @ 50V
|
-
|
13°C/W Jl
|
-65°C ~ 155°C
|
Through Hole
|
A, Axial
|
JANTX1N5802US |
MICROSEMI CORP |
|
Standard
|
50V
|
1A
|
875mV @ 1A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
25ns
|
1µA @ 50V
|
25pF @ 10V, 1MHz
|
13°C/W Jl
|
-65°C ~ 175°C
|
-
|
-
|
JANTXV1N5802US |
MICROSEMI CORP |
|
Standard
|
50V
|
1A
|
875mV @ 1A
|
Fast Recovery =< 500ns, > 200mA (Io)
|
25ns
|
1µA @ 50V
|
25pF @ 10V, 1MHz
|
13°C/W Jl
|
-65°C ~ 175°C
|
-
|
-
|