6-XFDFN Exposed Pad,Package / Case
6 parts found
Part Numbers Manufacturer Name Datasheet Voltage - Clamping Voltage - Off State Voltage - On State Unidirectional Channels Bidirectional Channels Voltage - Reverse Standoff (Typ) Voltage - Breakdown (Min) Current - Peak Pulse Power - Peak Pulse Power Line Protection Capacitance @ Frequency Operating Temperature Mounting Type Package / Case
PUSBM5V5X4-TL,115 NXP SEMICONDUCTORS
12V - - - 3 5.5V (Max) 6.4V 3A (8/20µs) 35W Yes - -30°C ~ 85°C Surface Mount 6-XFDFN Exposed Pad
RCLAMP3324T.TCT SEMTECH CORP
10.5V - - - 4 3.3V (Max) 3.8V 5A (8/20µs) 75W Yes 0.4pF @ 1MHz -40°C ~ 125°C Surface Mount 6-XFDFN Exposed Pad
PUSBM12VX4-TL,115 NXP SEMICONDUCTORS
12V - - - 3 5.5V (Max) 12.5V 3A (8/20µs) 35W Yes - -30°C ~ 85°C Surface Mount 6-XFDFN Exposed Pad
PUSBM30VX4-TL,115 NXP SEMICONDUCTORS
12V - - - 3 5.5V (Max) 32V 3A (8/20µs) 35W Yes - -30°C ~ 85°C Surface Mount 6-XFDFN Exposed Pad
PUSBM15VX4-TL,115 NXP SEMICONDUCTORS
12V - - - 3 5.5V (Max) 17V 3A (8/20µs) 35W Yes - -30°C ~ 85°C Surface Mount 6-XFDFN Exposed Pad
DF6F6.8MCTC(TE85L) TOSHIBA CORP
24V - - - 4 5V (Max) 6V 2.5A (8/20µs) - Yes 0.6pF @ 1MHz - Surface Mount 6-XFDFN Exposed Pad